IC Die Attach Adhesives
- BGA Die Attach – BT, Polyimide, & Black Oxide Substrates
- Leadframe Die Attach – NiPdAu, Copper, Silver Plated, and Alloy 42
- Die Paddle
- Die Stacking Die Attach
- Thermal B-Stage for Board on Chip (BOC)
- Thermal B-Stage for Bottom Die Attach
- B-Stage Wafer Back Coating for Melt through Wires Same-Die-Stack
- Custom Designed Adhesive Systems for all uses
- Sister Company designs Molecular Structures for each system
For Further Information, Please contact us.
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