BGA and Organic Substrate Packaging
Plastic BGA packaging is at the heart of packaging ICs for most commercial electronic systems. BGA packaging allows lower cost, reliable assembly, and rugged service life.
As Pin-counts increase and Formfactors decrease, BGA packaging Design & Manufacturing capabilities are able to keep up with these requirements.
Package Types
- Standard Single & Multi-Layered BGAs
- Array / Chip Scale Package (CSP) Type BGA
- Enhanced Thermal BGA
Build Up BGA- COB - Chip On Board
- SiP RF Module
- FC - Flipchip BGA
- Fine Pitch / Pattern BGA
- Thin Laminate BGA
Key Benefits
- Halogen Free & Lead Free Materials
- High Pin Count BGAs
- JEDEC MSL-2 and MSL-3 Level Capability
- Low, Medium, & High Volume Manufacturing
For Further Information, Please contact us.